Req ID: 120098

State/Province: Arizona

City: Tucson

Summary

The Lead Engineer, Manufacturing Process is responsible for designing, developing, deploying and optimizing processes for manufacturing to achieve quality cost and delivery goals for Celestica and its customers products.

Detailed Description

Performs tasks such as, but not limited to, the following:

• Design, develop, and implement new manufacturing processes to support customer products.

• Develop application software and tooling for a comprehensive set of complex machines and mechanical process steps within a manufacturing sector.

• Implement plan and lead the assessment of the capability of machines and process applications using Design of Experiments and statistical methods across the full manufacturing process, ensuring maximum utilization of critical resources, maximum throughput, minimum cost and capacity growth.

• Lead disciplined process for solving complex single stage or multistage product, process, component, and related problems that affect the efficient operation and/or manufacture of products through the full manufacturing process.

• Initiate and lead the assessment and provide feedback to product designers on suitability of designs for manufacturability.

Technical Skills

• NPI-PCBA: ESD, Component Prep, Laser marking, Solder Paste Deposition (screening / jetting) / Stencil Design, SMT component placement, Reflow, Tooling design, PTH soldering, PTH manual assembly, Press Fit assembly, Depanelization, Board level mechanical assembly, wire harness assembly, wire prep, SMT data analytics, SMT / PTH manual / automated rework, cleaning processes, coating / potting underfill / ruggedization processes, pack & ship, optical component assembly, fiber / tray handling processes, fiber splicing, IPC-610, quality data (KPI), Engineering Control & System Tools (ODC/SCE), Manufacturing Operational management, DFM - Mfg, DFA, DFR, Customer specific processes, structural test and inspection processes, machining, welding, CNC programming, secondary processes, sheet metal, DFAA.

• DFX: ESD Controls, Component Prep, Component Module Programming, Laser Marking, Screening, Stencil Design, Solder Paste Dispense / Jetting, SMT Programming, SMT Placement, SMT Reflow, Sweat Soldering, Flex Board Assembly / Handling, Pallet Design, PTH Soldering, Robot Soldering, PTH manual Assembly, PTH Auto Assembly, Pressfit, Depanelization, Mechanical Assembly (TIMs, Heatsinks, PCBA, Hotbar, Ultrasonic Welding), Wire Harness Assembly, Wire Prep, System Assembly, SMT and PTH Rework, Cleaning Processes, Conformal Coating, Underfills / Edgebonding / Potting, Pack and Ship, Chassis Assembly (fluidics, electrical enclosure, cable routing), Sheet Metal , Machining, Welding, Structural Test (API, AOI, AXI, ICT, Flying Probe)

• FA LAB: ESD Controls, Solder Metallurgy, Strain Gauge Analysis, SIR Testing, Solder Joint Reliability Modeling, Sample Prep (Grind and Polish), Dye & Pry, CMM/VMM, Lab X-Ray, Pull/Bend Testing, Vibration Testing, Drop Testing, TDR, XRF, SEM, FTIR, IC, Solderability Testing, Thermal Analysis, HALT/HASS, TH&B, Thermal Shock, ATC

• OPTICAL & XRAY INSPECTION: ESD Controls, Auto Wire Prep, SMT Data Analytics, API, AOI (PCBA), AXI (PCBA), AOI (System), Test Strategy Creation, IPC-610, Quality Dat (KPI), DFM - Manufacturing, DFA - Assembly, DFT / Physical Test, DFT - Electrical Test

• MACHINING & OTHER: ESD Controls, Pack & Ship, CNC programming, Secondary Processing, Sheet Metal, Machining, Welding, DFM - Manufacturing

• MECHANICAL & SYSTEMS ASSEMBLY: ESD Controls, Wire Harness Assembly, Auto Wire Prep, Mechanical Assembly - System Build, OEE / Industrial Engineering, Pack & Ship, Vacuum System, Fluidics, Electrical Enclosure, Cable Routing, Electrical - Automation, Mechanical - Automation, Machine Vision, IPC-610, Engineering Controls, Quality Data (KPI), Manufacturing Operational Management, DFM - Manufacturing, DFA - Assembly, DFAA - Automated Assembly, DFT - Physical Test

• PCBA ASSEMBLY: ESD, Component Prep, Laser marking, Solder Paste Deposition (screening / jetting) / Stencil Design, SMT component placement, Reflow, Tooling design, PTH soldering, PTH manual assembly, Press Fit assembly, Depanelization, Board level mechanical assembly, wire harness assembly, wire prep, SMT data analytics, SMT / PTH manual / automated rework, cleaning processes, coating / potting underfill / ruggedization processes, pack & ship, optical component assembly, fiber / tray handling processes, fiber splicing, IPC-610, quality data (KPI), Manufacturing Operational management, DFM - Mfg, DFA, DFR, Customer specific processes.

• MICROELECTRONICS: ESD Controls, Wafer Thinning, Wafer Singulation, Edge Polishing, Optical Coatings, Die Bonding, Vacuum Reflow, Flip Chip Bonding, Underfill, Active Alignment, Plasma Cleaning, Wire Bonding, Encapsulation, Sealing, Leak Testing, Interconnect Formation

Physical Demands

• Duties of this position are performed in a normal office environment.

• Duties may require extended periods of sitting and sustained visual concentration on a computer monitor or on numbers and other detailed data.

• Repetitive manual movements (e.g., data entry, using a computer mouse, using a calculator, etc.) are frequently required.

• Occasional travel may be required.

Typical Experience

• 1 to 3 years of related experience; Experience in similar job roles

Typical Education

• Bachelor's Degree or equivalent of experience and education

Notes

This job description is not intended to be an exhaustive list of all duties and responsibilities of the position. Employees are held accountable for all duties of the job. Job duties and the % of time identified for any function are subject to change at any time.

Celestica designs and manufactures a wide variety of electronic systems. Some of these systems are sensitive “dual-use” and “military” technologies which are governed by the U.S Department of Commerce’s Export Administration Regulations (EAR) or the U.S. Department of State’s International Traffic in Arms Regulations (ITAR).

Positions involve the release of export controlled goods either directly to employees or through the employee’s movement within the facility. As such, you will need to provide the necessary information to confirm you are a “U.S. Person” per Part 8, United States Code, Sections 1324b(a)(3): U.S. Citizen, Lawful permanent resident (green card holder), and certain other narrow categories including some refugees and individuals granted asylum.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran.

Celestica’s policy on equal employment opportunity prohibits discrimination based on race, color, creed, religion, national origin, gender, sexual orientation, gender identity, age, marital status, veteran or disability status, or other characteristics protected by law.

This policy applies to hiring, promotion, discharge, pay, fringe benefits, job training, classification, referral and other aspects of employment and also states that retaliation against a person who files a charge of discrimination, participates in a discrimination proceeding, or otherwise opposes an unlawful employment practice will not be tolerated. All information will be kept confidential according to EEO guidelines.