Summary:

Join Meta Reality Labs as a Hardware Miniaturization Design Electrical Engineer and play a pivotal role in shaping the future of the Wearables Product Line. As an experienced engineer with a proven track record of collaborating with internal design teams (PDE/EE/SIPI) and external production partners (Fab/Assy Vendors), you'll drive innovation into the product architecture by influencing designs and developing processes to enable complex miniaturized systems. Your expertise balancing trade-offs across different design solutions, vendor fabrication and assembly capabilities, and system electrical and reliability performance will be crucial to enable product miniaturization goals. If you are excited to work on cutting edge technology and products, we are excited for you to apply!

Required Skills:

Hardware Miniaturization Design Electrical Engineer Responsibilities:

1. Partner with internal hardware design teams from the earliest of conceptual stages to the developmPartner with internal hardware design teams from the earliest of conceptual stages to the development of high fidelity prototypes, with a line-of-sight to mass production.ent of high fidelity prototypes, with a line-of-sight to mass production.

2. Influence product design decisions to drive miniaturization into the way we build our products and work closely with our operations team in scaling our manufacturing builds with a focus on quality and reliability.

3. Investigate, develop, and evaluate new cutting-edge material and processes in collaboration with our critical FPC/RFPC vendors, to meet project miniaturization requirements and influence supplier’s roadmaps.

4. Ensure understanding of system integration, advising mechanical, electrical, and optical design engineers in implementing design for assembly and manufacturability into their designs.

5. Collaborate cross functionally within the engineering community to solve difficult problems and implement meaningful solutions.

6. Travel both domestically and internationally.

Minimum Qualifications:

Minimum Qualifications:

7. Bachelor’s degree in Electrical Engineering or equivalent experience.

8. 5+ years of industry experience working on complex/miniaturized board designs (PCB/FPC/RFPC).

9. Proficiency in EDA tools(schematic capture) and some layout experience.

10. Knowledge of conventional PCB/FPC/RFPC fabrication processes and corresponding general design rules.

11. Experience partnering with designers and electrical engineers to optimize board material stack-ups to enable product performance requirements, improve assembly, and achieve desired miniaturization

12. Experience collaborating with cross-functional teams to integrate board designs (PCB/FPC/RFPC) technologies into product designs and manufacturing operations.

13. Experience with high-volume manufacturing engineering processes involving printed circuit board assembly (Board fabrication, SMT, Through-Hole, Pin-in-Paste), rigid flexible printed circuits (RFPC), flexible printed circuits (FPC), SIP (System In Package) and/or mechanical systems integration within a concurrent environment.

Preferred Qualifications:

Preferred Qualifications:

14. Master’s degree in Electrical or equivalent engineering discipline.

15. Product experience across mobile, wrist, AR and/or miniaturized computing.

16. Experience partnering with domestic and overseas manufacturing partners to create processes to assemble consumer products, in mass production settings.

17. Silicon packaging experience (SiP, PoP) - defining, designing, and understanding the manufacturing processes involved to fabricate and validate the custom package.

18. Experience in semiconductor packaging, specifically with Redistribution Layer (RDL) technologies with understanding of design rules and reliability issues associated with RDL in advanced packaging.

19. Proven track record of working on projects involving multi-layer RDL structures & familiarity with industry standards and best practices for RDL design and reliability.

20. Experience with product-level failure mode investigation and analysis techniques (Dye and Pry, Cross section, Xray) as well as experience correlating given failure modes to specific process, material and design related stressors.

21. Experience with common PCB CAD layout and DFM software (Cadence/Valor), industry standards (IPC, JEDEC, IEEE, EIA, etc.), 3D design tools (NX), FEA, and other CAD suites.

22. Experience with design for six sigma, inclusive of structure problem solving approach, design experimentation and optimization (DOE), root cause and defect/failure analysis, FMEA, FEA, reliability testing, statistical data analysis, manufacturing process knowledge (MSA/GRR).

23. Experience distilling down highly technical topics into clear and concise messaging to cross-functional teams and leadership.

Public Compensation:

$139,000/year to $200,000/year + bonus + equity + benefits

Industry: Internet

Equal Opportunity:

Meta is proud to be an Equal Employment Opportunity and Affirmative Action employer. We do not discriminate based upon race, religion, color, national origin, sex (including pregnancy, childbirth, or related medical conditions), sexual orientation, gender, gender identity, gender expression, transgender status, sexual stereotypes, age, status as a protected veteran, status as an individual with a disability, or other applicable legally protected characteristics. We also consider qualified applicants with criminal histories, consistent with applicable federal, state and local law. Meta participates in the E-Verify program in certain locations, as required by law. Please note that Meta may leverage artificial intelligence and machine learning technologies in connection with applications for employment.

Meta is committed to providing reasonable accommodations for candidates with disabilities in our recruiting process. If you need any assistance or accommodations due to a disability, please let us know at accommodations-ext@fb.com.