Substrate Development:

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Designing and developing advanced glass substrates for semiconductor packaging solutions;

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Evaluating material properties, compatibility, and performance for various applications;

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Troubleshooting integration issues and collaborating with design, quality, and manufacturing teams to resolve challenges;

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Conducting material characterization and analysis to ensure substrates meet functional and reliability requirements;

Process Development and Optimization:

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Developing and refining manufacturing processes for glass substrate fabrication and integration;

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Optimizing process parameters to improve yield, efficiency, and cost-effectiveness of integration processes;

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Collaborating with the production teams to implement scalable and repeatable manufacturing techniques;

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Investigating and mitigating process-related defects through root cause analysis and corrective actions;

Collaboration with Cross-functional Teams:

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Working closely with design engineers, test engineers, and the production team to ensure smooth integration of substrates into packaging solutions;

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Providing feedback on design feasibility and suggestions for improving the integration processes;

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Supporting the production team in ramp-up and troubleshooting activities;

Project Management:

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Manage substrate development and integration projects, ensuring timely delivery and adherence to budgets and specifications;

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Defining project scope, deliverables, and timelines in coordination with stakeholders;

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Tracking project progress, managing risks, and ensuring alignment with business goals;

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Preparing and maintaining technical documentation, including timeline, progress reports, and test plans;

Design Validation:

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Performing design simulations and experimental testing to validate substrate performance;

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Analyzing test data, identifying failure modes, and proposing design and process improvements;

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